Microchip Technology MSCSM70HM19T3AG

安装类型

底座安装

包装/外壳

Module

供应商器件包装

-

厂商

微芯片技术

Package

Bulk

Product Status

活跃

Current - Continuous Drain (Id) @ 25℃

124A (Tc)

Vds - Drain-Source Breakdown Voltage

700 V

Typical Turn-On Delay Time

40 ns

Vgs th - Gate-Source Threshold Voltage

1.9 V

Pd - Power Dissipation

365 W

Transistor Polarity

N-Channel

Maximum Operating Temperature

+ 175 C

Vgs - Gate-Source Voltage

- 10 V, 23 V

Minimum Operating Temperature

- 40 C

Factory Pack QuantityFactory Pack Quantity

1

Mounting Styles

螺钉安装

Manufacturer

Microchip

Brand

微芯片技术

Rds On - Drain-Source Resistance

19 mOhms

RoHS

Details

Typical Turn-Off Delay Time

50 ns

Id - Continuous Drain Current

124 A

系列

-

操作温度

-40°C ~ 175°C (TJ)

类型

Full Bridge SiC MOSFET Power Module

子类别

Discrete Semiconductor Modules

技术

SiC

配置

全桥

功率 - 最大

365W (Tc)

场效应管类型

4 N-Channel (Full Bridge)

Rds On(Max)@Id,Vgs

19mOhm @ 40A, 20V

不同 Id 时 Vgs(th)（最大值）

2.4V @ 4mA

输入电容(Ciss)(Max)@Vds

4500pF @ 700V

门极电荷(Qg)(最大)@Vgs

215nC @ 20V

上升时间

40 ns

漏源电压 (Vdss)

700V

产品类别

Discrete Semiconductor Modules

场效应管特性

Silicon Carbide (SiC)

产品

功率MOSFET模块

产品类别

Discrete Semiconductor Modules