Winbond Electronics Corporation W979H6KBVX2I/TRAY

引脚数

134

Automotive

无

PPAP

无

DRAM Type

Mobile LPDDR2 SDRAM

Chip Density (bit)

512M

Number of Internal Banks

4

Number of Words per Bank

8M

Number of Bits/Word (bit)

16

Data Bus Width (bit)

16

Maximum Clock Rate (MHz)

400

Maximum Access Time (ns)

5.5

Address Bus Width (bit)

15

Interface Type

HSUL_12

Minimum Operating Supply Voltage (V)

1.14|1.7

Typical Operating Supply Voltage (V)

1.2|1.8

Maximum Operating Supply Voltage (V)

1.3|1.95

Operating Current (mA)

175

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Number of I/O Lines (bit)

16

Mounting

表面贴装

Package Height

0.58

Package Width

10

Package Length

11.5

PCB changed

134

Standard Package Name

BGA

Supplier Package

VFBGA

Lead Shape

Ball

ECCN (US)

EAR99

EU RoHS

Compliant

零件状态

NRND

组织结构

32Mx16