Winbond Electronics Corporation W97BH2LBVX2E

表面安装

YES

终端数量

134

Chip Density (bit)

2G

Number of Internal Banks

8

Number of Words per Bank

8M

Number of Bits/Word (bit)

32

Data Bus Width (bit)

32

Maximum Clock Rate (MHz)

400

Maximum Access Time (ns)

5.5

Address Bus Width (bit)

17

Interface Type

HSUL_12

Minimum Operating Supply Voltage (V)

1.14|1.7

Typical Operating Supply Voltage (V)

1.2|1.8

Maximum Operating Supply Voltage (V)

1.3|1.95

Operating Current (mA)

190

Minimum Operating Temperature (°C)

-25

Maximum Operating Temperature (°C)

85

Number of I/O Lines (bit)

32

Mounting

表面贴装

Package Height

0.58

Package Width

10

Package Length

11.5

PCB changed

134

Supplier Package

VFBGA

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8542.32.00.36

Automotive

无

PPAP

无

DRAM Type

Mobile LPDDR2 SDRAM

Package Description

VFBGA,

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Number of Words Code

256000000

Package Body Material

PLASTIC/EPOXY

Rohs Code

有

Manufacturer Part Number

W97BH2LBVX2E

Number of Words

268435456 words

Supply Voltage-Nom (Vsup)

1.2 V

Package Code

VFBGA

Package Shape

RECTANGULAR

Manufacturer

Winbond Electronics Corp

Part Life Cycle Code

不推荐

Ihs Manufacturer

WINBOND ELECTRONICS CORP

Risk Rank

5.66

零件状态

Unconfirmed

ECCN 代码

EAR99

附加功能

SELF REFRESH; IT ALSO REQUIRES 1.8V NOM

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.65 mm

Reach合规守则

compliant

引脚数量

134

JESD-30代码

R-PBGA-B134

电源电压-最大值(Vsup)

1.3 V

电源电压-最小值(Vsup)

1.14 V

端口的数量

1

操作模式

SYNCHRONOUS

组织结构

64Mx32

座位高度-最大

1 mm

内存宽度

32

记忆密度

8589934592 bit

内存IC类型

DDR DRAM

访问模式

多库页面突发

自我刷新

YES

宽度

10 mm

长度

11.5 mm